As power electronics move toward higher power density and miniaturization, efficient liquid cooling has become essential. FSW is widely used in liquid cooling plates and cooling assemblies, creating strong, sealed joints between base plates and cover plates for reliable thermal management.

Main Applications

Liquid Cooling Plates for Power Modules
Suitable for thermal management of IGBT, SiC, GaN, and other power semiconductor devices.

EV Power Electronics Systems
Applied to motor controllers, battery management systems, on-board chargers, and other EV power electronic components.

Customized Cooling Solutions
Used for inverters, converters, energy storage systems, and complex liquid cooling plates with internal flow channels.

Key Advantages

Excellent Sealing Performance
Produces pore-free welds with strong sealing reliability, helping prevent leakage in liquid cooling systems.

Low Distortion & High Stability
Solid-state joining creates a narrow heat-affected zone, low distortion, and high dimensional accuracy.

Reliable Heat Transfer
High-strength joints with good corrosion resistance help maintain cooling efficiency and long-term performance.

Flexible Customization
Supports complex flow-channel designs and customized cooling plates with efficient, cost-effective production.